Advanced Package Rework
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In-stock orders will ship in 3 business days or less after receipt of order.
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*The weight listed is gross product weight including standard packaging, actual shipment weight may vary.
COMPONENT, BGA, 256 BALL, 0.50MM DIA, 1.00MM PITCH, 17.0MM X 17.0MM BODY, 5 PACK
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COMPONENT, BGA, 368 BALL, 0.18MM DIA, 0.30MM PITCH, 8.0MM X 8.0MM BODY, 5 PACK
SOLDER BALLS, LEAD-FREE, SAC305, 0.76MM, PACK OF 250K
SOLDER BALLS, LEADED, 0.76MM, PACK OF 250K
ADJUSTABLE COMPONENT NEST, BGA
FLUX DIP TRANSFER PLATES, BGA, .30MM DEPTH, 28MM 35MM & 45MM NESTS, 3 PLATES
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